ON Semiconductor releases integrated solutions for industrial motor drives at APEC 2021
June 15, 2021—ON Semiconductor (NASDAQ: ON), which promotes energy-efficient innovation, launches a new, integrated, converter-inverter-power factor correction (PFC) Modules used to drive motors for applications such as fans and pumps in industrial motor drives, servo drives, and heating, ventilation and air conditioning (HVAC).
The new NXH50M65L4C2SG and NXH50M65L4C2ESG are die-casting power integrated modules (TMPIM) based on a standard alumina (AI2O3) substrate and an enhanced low thermal resistance substrate, respectively. These modules are very suitable for rugged industrial applications with high output power. They contain a converter-inverter-PFC circuit consisting of a single-phase converter integrating four 75 A, 1600 V rectifiers. The three-phase inverter uses 6 50 A, 600 V IGBTs with integrated reverse diodes. The dual-channel interleaved PFC includes two 75 A, 650 V PFC IGBTs with integrated reverse diodes, and two 50 A, 650 V IGBTs. PFC diode. The die-casting power integrated module is embedded with a negative temperature coefficient (NTC) thermistor to monitor the device temperature during operation.
Since the module is pre-packaged with an optimized layout and configuration, the parasitic elements are very small compared to PCB-based discrete designs, thereby achieving a wide PFC switching frequency range between 18 kHz and 65 kHz. The energy-efficient NXH50M65L4C2SG and NXH50M65L4C2ESG have a rated current of 50 A and can be used in applications up to 8 kW. They are the latest devices in the ON Semiconductor TMPIM series. The rated currents of other devices are 20 A and 30 A.
The compact die-casting die DIP-26 package size is only 73 mm x 47 mm x 8 mm-saving 20% of the area than the current solution, achieving a higher power density level. The hermetic and rugged package includes an integrated heat sink (6 mm from the pins) and provides a high level of corrosion resistance.
ON Semiconductor also offers silicon carbide (SiC) configuration options to further improve switching frequency and energy efficiency.
The new NXH50M65L4C2SG and NXH50M65L4C2ESG are equipped with FAN9672 PFC controller and gate driver solutions, including the new NCD5700x series of devices. The recently introduced NCD57252 dual-channel isolated IGBT/MOSFET gate driver provides 5 kV electrical isolation and can be configured for dual lower bridge, dual upper bridge, or half-bridge operation. NCD57252 adopts a small SOIC-16 wide-body package, accepts logic level input (3.3 V, 5 V, and 15 V). This high-current device (at Miller platform voltage, source current 4.0 A/sink current 6.0 A) is suitable for high-speed operation because the typical propagation delay is 60 ns.
Driving the motor in the most energy-efficient manner is the key to simplifying installation, reducing heat accumulation, improving reliability, and reducing system costs. ON Semiconductor’s TMPIM devices standardize output pins, minimize parasitic elements, and provide designers with a high-performance "plug and play" solution. Combine NXH50M65L4C2SG and NXH50M65L4C2ESG with FAN9672 and NCD57252 to provide a fast design path to achieve precise and energy-efficient motor control solutions.
During APEC 2021, ON Semiconductor will demonstrate SiC solutions for industrial applications.